My Report

Manufacturing Processes II Mock Test 4


Correct Answer: 2 points | Wrong: -1 point
Grades: A* (100% score) | A (80%-99%) | B (60%-80%) | C (40%-60%) | D (0%-40%)
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 10%

Question 1 of 10

1. The diameter of the pores can be said to be dependant on the diffusion of electronic holes injected from the noble metal-silicon interface.

Question 1 of 10

Question 2 of 10

2. Silicon wires with square and rectangular can be produced by IL technique.

Question 2 of 10

Question 3 of 10

3. Intrinsic properties of silicon substrate have no effect in the metal assisted etching of Si.

Question 3 of 10

Question 4 of 10

4. MRAFF is the hybrid finishing process of MRF and AFF.

Question 4 of 10

Question 5 of 10

5. In chemo-mechanical polishing (CMP) process, material is removed due to abrading.

Question 5 of 10

Question 6 of 10

6. In AJMM, workpiece is exposed to abrasive action of the particles.

Question 6 of 10

Question 7 of 10

7. Brittle fracture can occur due to indentation rupture.

Question 7 of 10

Question 8 of 10

8. Micro machining processes (MMPs) are used to increase selectivity, accuracy, performance, etc. parameters.

Question 8 of 10

Question 9 of 10

9. CMP is used for flat surfaces only.

Question 9 of 10

Question 10 of 10

10. Erosion rate is directly proportional to velocity of the jet.

Question 10 of 10


 

Manish Bhojasia - Founder & CTO at Sanfoundry
Manish Bhojasia, a technology veteran with 20+ years @ Cisco & Wipro, is Founder and CTO at Sanfoundry. He lives in Bangalore, and focuses on development of Linux Kernel, SAN Technologies, Advanced C, Data Structures & Alogrithms. Stay connected with him at LinkedIn.

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