Manufacturing Processes II Practice Test 3

1. Morphology of μpSi and mpSi can be defined by a concrete spatial distribution.

2. Which of the following alkaline etchant is most widely used to etch silicon?

3. Lithographic technique can be used for patterning the Si wafer.

4. If the etching conditions are not controlled, then _____ decreases with pore depth.

5. Silicon oxide layer can be removed using HF solution.

6. μpSi structures have _____________

7. The oxide later formed on commercial Si does not affect the etching of Si.

8. Etching rate of silicon is independent of the crystal planes.

9. Which of the following is true about chemical dissolution of hydrogen-terminated silicon in HF based solutions.

10. Low pressure chemical vapour deposition (LPCVD) is used to_____