My Report

Manufacturing Processes II Practice Test 4


Correct Answer: 2 points | Wrong: -1 point
Grades: A* (100% score) | A (80%-99%) | B (60%-80%) | C (40%-60%) | D (0%-40%)
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1. The pores produced by RIE etching can have a thin defective region.

2. Magneto rheological abrasive finishing (MRF) is a magnetic field assisted process.

3. Etching through Pt particles can generate straight as well as helical-like pores.

4. Nanosphere lithography method is another lithographic approach extensively used to produce pSi structures.

5. In chemo-mechanical polishing (CMP) process, material is removed due to abrading.

6. At high aspect ratio, silicon nanowires tend to form bundles.

7. In AJMM, material removal starts when the fracture strength is reached.

8. MRAFF is the hybrid finishing process of MRF and AFF.

9. CMP is used for flat surfaces only.

10. In magnetic flow polishing process, very small force is applied by the abrasives.


 

Manish Bhojasia - Founder & CTO at Sanfoundry
Manish Bhojasia, a technology veteran with 20+ years @ Cisco & Wipro, is Founder and CTO at Sanfoundry. He lives in Bangalore, and focuses on development of Linux Kernel, SAN Technologies, Advanced C, Data Structures & Alogrithms. Stay connected with him at LinkedIn.

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